Imaging Processing Unit
Project Overview
Our task was to develop an IP67‑rated image processor from the ground up. This custom unit captures and processes signals from computer‑vision cameras and relays commands to various system components, supporting automation and monitoring in demanding environments.
The Challenge
The processor had to withstand outdoor conditions without compromise. It needed full IP67 weatherproofing, resistance to shock and vibration, strict EMC compliance to prevent interference, and robust thermal management to operate reliably in ambient temperatures up to 55 °C.
Our Solution
We began with first‑principles heat‑transfer calculations to size heatsinks and select optimal thermal interface materials. Robust connectors, EMC gaskets and shielding were chosen to ensure electromagnetic compatibility, while shock‑ and vibration‑proof mounts protected the circuit board. CAD simulations and prototype testing validated weatherproof seals and thermal performance, and rapid iterations refined the design until all IP67, EMC and heat‑dissipation requirements were met.
Results
The first prototype passed thermal, EMC, weatherproof and shock/vibration tests without modification. We delivered comprehensive engineering data and test reports to the client, enabling a seamless production handover. As a result, the client launched their image‑processor product on schedule, fully compliant with industry standards and ready for market.
Project Details
Client
Confidential Client (under NDA)
Location
Auckland, New Zealand
Year
2021-2022
Services Provided
Specification, Concept Development, Engineering Design, Prototype, Production
Technologies Used
Hand sketches, CAD, Thermal analysis, Electromagnetic Compliance (EMC), IP67, 3D printing, machining, sheet metal, laser cut, electromechanical assembly, prototyping assembly, prototyping testing, engineering data control, assembly instructions
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